With the guidance of Prof. Zhuang, the project will develop a computational framework based on IGABEM to study the flexoelectric nanostructures including the electromechanical coupling, interface fracture, flexoelectric effect of these materials at different scales, etc. To improve the analysis efficiency of local features of interest, we will develop an adaptive local refinement scheme by considering the element distance ratio and physical error estimation. The isogeometric finite element and boundary element coupling approach based on non-uniform rational B-splines (NURBS) will be developed to simulate the flexoelectric nanostructures for some nonlinear problems. The proposed numerical scheme will then be used to study the multilevel interconnect structure in electronic packaging.
Dr. Gong is currently an Associate researcher with Beijing University of Technology. His current research interests include computational mechanics, multiscale simulation, model reduction techniques with special attention to semiconductor and electronic packaging structures.
